Optical Metrology Systems
Our Metrology Systems
Advanced Spectral Technology (AST) delivers high-performance optical metrology systems that provide accurate and repeatable measurements for critical applications in the semiconductor, photonics, MEMS, and advanced manufacturing industries.
Our optical metrology systems integrate precision optics, advanced illumination techniques, and proprietary software to deliver exceptional measurement capabilities across visible, NIR, and SWIR spectra.
VCSEL OA Metrology System
AST-VCSEL
The AST-VCSEL system delivers high-precision optical aperture measurements for vertical-cavity surface-emitting lasers with 10-25nm repeatability, advanced contrast enhancement capabilities, and programmable illumination across visible through SWIR spectra to provide critical quality control for VCSEL manufacturing processes.
CD & Overlay Metrology System
AST-CDO
The AST-CDO system provides critical dimension and overlay metrology with repeatability of 5-25nm and 10-50nm respectively, enabling semiconductor manufacturers to verify precise layer alignment, inspect bonded wafers, measure feature dimensions, and optimize process control with throughput of 30 wafers per hour.
Wafer & Die Inspection System
AST-WDI
The AST-WDI defect detection system delivers high-precision quality assurance for semiconductor manufacturing, identifying microscopic defects with sub-micron accuracy. This advanced inspection platform integrates seamlessly into production environments, detecting particles, scratches, and pattern irregularities early in the manufacturing process to maintain optimal yields and process control.
Automated MEMS Inspection System
AST-MEMS (Automated)
The Automated MEMS Inspection System provides advanced imaging capabilities for microelectromechanical systems, delivering exceptional subsurface visualization and precise metrology. With both Near-Infrared (NIR) and Short-Wave Infrared (SWIR) imaging technologies, this system penetrates silicon and other wafer materials to inspect hidden structures, measure critical dimensions, and verify alignment in complex multi-layer MEMS devices.
MEMS Inspection Workstation
AST-MEMS (Workstation)
The MEMS Inspection Workstation provides advanced imaging capabilities for microelectromechanical systems, delivering exceptional inspection capabilities including subsurface visualization and high-precision metrology performance within an integrated ergonomic workstation platform. Visible, Near-Infrared (NIR), and Short-Wave Infrared (SWIR) imaging technologies provide the capability to image through silicon and other wafer materials to inspect hidden structures, measure critical dimensions, and verify alignment in complex MEMS devices.
Automated NIR/SWIR Metrology & Inspection System
AST-IR (Automated)
The AST-IR delivers breakthrough subsurface inspection capabilities for silicon and other wafer materials. This automated system penetrates through silicon to reveal hidden defects and alignment issues in bonded dies, wafers, and MEMS devices. By leveraging advanced NIR and SWIR imaging technology, the system provides critical insights for 3D stacking, wafer bonding, and failure analysis applications.
NIR/SWIR Metrology & Inspection Workstation
AST-IR (Workstation)
The NIR/SWIR Metrology & Inspection Workstation provides powerful subsurface imaging capabilities in a compact, versatile platform. This workstation penetrates through silicon and other wafer materials to reveal hidden structures, alignment issues, and defects with exceptional clarity. By harnessing advanced infrared imaging technology, the system delivers critical visualization for semiconductor, MEMS, and microelectronics applications where seeing beyond the surface is essential.
Contact Sales
Our metrology systems can be fully customized to meet your requirements. If you have questions about our product offerings or capabilities, please contact us for more information.