AST-WDI
Wafer & Die Inspection System
The AST-WDI defect detection system delivers high-precision quality assurance for semiconductor manufacturing, identifying microscopic defects with sub-micron accuracy. This advanced inspection platform integrates seamlessly into production environments, detecting particles, scratches, and pattern irregularities early in the manufacturing process to maintain optimal yields and process control.
Product Highlights
The AST-WDI platform combines sophisticated AI capabilities with multi-spectral imaging technology to perform comprehensive wafer and die-level quality assessments. The system features a flexible configuration with high-resolution optics and multiple illumination options to detect even the most challenging defects across various semiconductor applications.
- 300mm x 300mm X-Y travel with 100mm Z-axis capability
- Configurable with multiple wafer handling options: open cassette (50mm-200mm), SMIF (200mm), and FOUP (300mm)
- High-resolution optical system supporting 5X to 100X brightfield and darkfield objectives
- Advanced Thickness Measurement Technology – Precisely measure Through Silicon Vias (TSVs), Wafer/Layer Thickness, Photoresist thickness, etc.
- Compatible with ISO 5 cleanroom environments, with ISO 4 option
- Comprehensive dimensional measurement tools including video edge detection and geometric constructions
- Advanced ScopeViewer3 Software with AI-powered defect detection algorithms
Applications
- Detection of sub-micron defects including particles, scratches, and pattern irregularities
- Pattern verification to confirm accurate replication of complex semiconductor designs
- Quality assurance and process control monitoring for manufacturing yield optimization
- Wafer-level inspection for early defect identification
- Die-level inspection for final quality verification
- Custom inspection solutions for specialized semiconductor components
- TSV depth Measurements
- Film / Photoresist Thickness Measurements
Full Specifications
- 300mm x 300mm X-Y Travel
- 100mm Z-axis Travel
- ISO 5 (Class 100) Cleanroom Compatible
- ISO 4 (Class 10) Cleanroom Option
- Semi S2 / S8 Protocol Compliant
- System can be configured with or without wafer
loader - Open cassette – wafers & film frames (50mm to
200mm) - SMIF (200mm wafers) & FOUP (300mm wafers)
- Custom die-level carrier & packaging assembles
- High-Resolution Optical System supporting
- 5X, 10X, 20X, 50X, & 100X BF & DF objectives
- Standard Video Auto-Focus
- Optional Tracking Laser Auto-Focus
- Brightfield, Darkfield, Kohler Illumination
- Optional Infrared (NIR & SWIR) Illumination with
5-Position Filter Wheel
Contact Sales
Our metrology systems can be fully customized to meet your requirements. If you have questions about our product offerings or capabilities, please contact us for more information.