Semiconductor / MEMs Solutions

AST provides turnkey system solutions to Semiconductor & MEMS manufacturing that address critical imaging and inspection process requirements at wafer, die, and film frame level.  This includes optimized high-performance solutions for defect detection & review, metrology, and classification.  Advanced IR Imaging capability including NIR (Near-wave infrared) and SWIR (short-wave infrared) enables the detection of critical defects and overlay metrology / alignment that would otherwise go undetected using visible wavelengths for inspection.

These fully-integrated systems address both development and production requirements.  These system solutions are highly flexible and can be configured with advanced automated part (wafer, die, film frame) handling options.  These systems are also capable of being dynamically tuned to achieve the highest level of image quality and performance based on the type, structure, and material composition of the wafer and/or die.


CD Overlay / Metrology

Ability to accurately and repeatably measure critical features and alignment

Defect Detection & Review

Advanced automated inspection combining high-speed image capture and defect detection capability

Automated Wafer / Part-Handling

AST provides system solutions at die to wafer level including thinned wafers or wafers on carriers

Assembly & Integration

Solutions that are designed to meet specific manufacturing / process requirements

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