Automated wafer / part-handling options are available to support a variety of requirements including 150, 200, & 300mm wafers, tape frames, and die carriers. These automated loader options can support bonded and thinned wafers and include OCR, pre-align, and sorting capability.
AST works collaboratively with our customers to determine best optimized wafer / part-handling solution for seamless integration with AST metrology & inspection systems.