AST-CDO

CD & Overlay Metrology System

The AST-CDO metrology system provides a high-precision measurement solution for validating critical dimensions and ensuring accurate alignment verification between layers on bonded and multi-layer semiconductor wafers.  This advanced metrology system provides superior optical-based measurement technology with automated wafer handling configurations for achieving optimum performance and capability.

AST-CDO

System Highlights

AST’s CD & Overlay Metrology System utilizing advanced measurement technology to ensure critical wafer features are within tolerance to achieve optimum performance and ensure wafer processes and specifications remain in control.  The capability to image through layers of the wafer to detect any misalignment caused by mask errors, process variations, and equipment inaccuracies during manufacturing are identified with a high-degree of precision and performance.  The ability of the AST-CDO system to be configured and implement tunable wavelength specific imaging of an overlay alignment pattern through multiple-layers of a wafer that may consist of differences of the material properties and characteristics that impact image quality and contrast for confirming layer-to-layer overlay alignment.  The AST-CDO system addresses and optimizes the measurement performance of each layer based on its wavelength transmission properties.

Applications

CD Overlay SWIR Image Alignment Target

Full Specifications

Contact Sales

Our metrology systems can be fully customized to meet your requirements. If you have questions about our product offerings or capabilities, please contact us for more information. 

Download Datasheet

Please complete the form below to access the datasheet.