Wafer / Chip / Die Manufacturing

AST’s solutions for inspection & metrology provide advanced precision, performance and capability.  These fully automated systems are highly configurable enabling virtually any wafer, chip, and / or die inspection / measurement application to optimized.  

This is achieved through the ability to integrate one or more optical / vision systems that include NIR (Near-wave infrared) and SWIR (short-wave infrared) for detection of critical defects and overlay metrology / alignment of bonded wafers.  High-resolution micro & macro visible wavelength imaging options provide additional imaging capability & flexibility.  

These fully-integrated systems address both development and production requirements.  These precision, high-performance system solutions are highly flexible and can be configured with advanced automated part (wafer, die, film frame) handling options.  These systems are also capable of being dynamically tuned to achieve the highest level of image quality and performance based on the type, structure, and material composition of the wafer, chip, and/or die.

Applications

Metrology

Ability to accurately and repeatably measure critical features and alignment

Defect Detection & Review

Advanced automated inspection combining high-speed image capture and defect detection capability

Cleaning Automation

Custom automation solution for production cleaning processes that can be configured as a standalone turnkey system or with integrated AOI defect / particle detection

Assembly & Integration

Solutions that are designed to meet specific manufacturing / process requirements

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